Cognata’s large-scale parallel validation cloud framework shone in 2021 China Automotive Semiconductor Industry Conference
July 2021
On June 30, 2021, China Automotive Semiconductor Industry Conference2021
was successfully concluded in Shanghai. The conference lasted for two days,
focusing on the status quo of chipset shortage of Chinese automobile enterprises,
safety construction of localization of supply chain, construction and design of
onboard chip platform, chip demand and application cases in the field of
autonomous driving and intelligent cockpit, application of power semiconductor
in the three electrics, chip test and functional safety, etc.
Many chip manufacturers, semiconductor manufacturers, autopilot, domain
controller and other manufacturers participated in the event, such as ChinaiASTI
Testing Service, Black Sesame technologies, Chipon, ArcSoft, NOVOSENSE,
Longsys, InfiRay, Hongke electronics, Cognata, ZLG, TransMicrowave, ANSYS,
MobileDrive, SUNNET, PRATIC etc.
Cognata large-scale validation and training cloud framework, with flexible
parametric configuration can adapt to the dynamic model and traffic flow
model requirements of different industries (such as passenger cars, trucks,
agricultural vehicles, agricultural machinery, etc.), and its highly scalable
API and SDK allow users to quickly integrate with other existing simulation
tools and test tools, saving hardware and software resources, enabling users
to carry out the training and validation of automatic driving algorithms and
perception algorithm in a faster and more convenient manner.
Photo credit: China Automotive Semiconductor Industry Conference